Fungal Deterioration Effect on Mechanical Properties of Epoxy Jute Hemp Composites

Authors

  • G. Pavan Kumar M.Tech. Student, Department of Mechanical Engineering, Jawaharlal Nehru Technological University, Anantapur, Andhra Pradesh, India
  • B. Omprakash Assistant Professor, Department of Mechanical Engineering, Jawaharlal Technological University, Anantapur, Andhra Pradesh, India

DOI:

https://doi.org/10.5281/zenodo.11044489

Keywords:

Jute fibre, Hemp fibre, Epoxy resin

Abstract

Studies on composites play a crucial role in various engineering applications. These composites find extensive usage in aerospace, marine, automobile industries, and other industrial sectors due to their cost-effectiveness and advantageous properties such as recyclability and health benefits. Moreover, these composites are environmentally friendly, biodegradable, and sustainable. In this project, jute and hemp fibers, along with epoxy, were utilized in composite manufacturing. The hybrid jute-hemp composites were fabricated using the hand layup technique. Thanks to their low specific gravity and high strength-to-weight ratio, these composite materials outperform metallic materials. The primary objective of this project is to investigate the mechanical properties of hybrid jute-hemp composites, including tensile, impact, and flexural strength, under various conditions such as no water-fungi exposure, water immersion, and water-fungi exposure. Yeast was employed as the fungal agent in this study. Mechanical testing was conducted at intervals of 9 days, 18 days, and 27 days, respectively, in accordance with ASTM standards. The mechanical properties are to be determined through tension, impact, and flexural tests following the procedures outlined in ASTM standards. Finally, upon obtaining the test results, the values are analysed and compared.

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Published

23-04-2024

Issue

Section

Articles

How to Cite

[1]
G. P. Kumar and B. Omprakash, “Fungal Deterioration Effect on Mechanical Properties of Epoxy Jute Hemp Composites”, IJRAMT, vol. 5, no. 4, pp. 58–64, Apr. 2024, doi: 10.5281/zenodo.11044489.